Custom FPC Fabrication Flexible PCB Rapid Fire Mod Chip for PS5 Playstation

• Structure: Multilayer FPC
• Material: Polyimide
• Combination Mode: Adhesive Flexible Plate
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: XT0717-1
• Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
• Conductive Adhesive: Conductive Silver Paste
• Flame Retardant Properties: V1
• Processing Technology: Electrolytic Foil
• Base Material: Pi
• Insulation Materials: Organic Resin
• Brand: Newtrue
• Copper Thickness: 35um,1oz,2oz
• Min. Hole Size: 0.15mm
• Min. Line Width: 0.075mm(3mil)
• Min. Line Spacing: 0.075mm(3mil)
• Layer: 1~8 Layers
• Color: Yellow
• PCB Assembly: Through-Hole
• Solder Heat Resistance: 10 Sec
• Transport Package: 15X10X21cm
• Trademark: Newtrue
• Origin: Made in China
• Production Capacity: 50000squre Meters
• Package Size: 21.00cm * 28.00cm * 6.00cm
• Package Gross Weight: 0.980kg

Product Description

Ps5 Rapid Fire Mod Chip pcb Board,PCB Rapid , Flexible PCB ,FPC  Fabrication             
 

Product Parameters

Industry-specific attributes

Product name	Flex PCB
Base Material	FR-4,CEM-1,CEM-3,Hight TG,FR4
Board Thickness	0.11mm-0.5mm
Board Size	Min: 10x45mm Max:250x1200mm
Model Number	XT0717-1
Type	FPC
Place of Origin	Guangdong, China
Brand Name	Xinda-ok
Copper Thickness	35um,1oz,2oz
Min. Hole Size	0.15mm
Min. Line Width	0.075mm(3mil)
Min. Line Spacing	0.075mm(3mil)
Surface Finishing	HALS/HALS lead free,Chemical
Solder mask color	Yellow PI
Layer	1~8Layers
Material	PI/PET/PEM/FR-4
Characteristic	Small Thickness
Color	yellow
PCB Assembly	Through-hole
Length	customized
Solder Heat Resistance	10 Sec
Test	100% Electrical

 

Process parameters
Number of layers of soft board	1~8
Maximum processing area	1900mm*250mm
The thickness of the finished product of the processed plate	0.036mm~2.4mm
Wire copper foil thickness	9μm~70μm (1/4oz~2oz)
Minimum hole diameter	≥4mil (0.1mm)
Minimum line width/line spacing	1.8mil/1.8mil(0.045mm/0.045mm)
Surface treatment process	chemical immersion gold, OSP, electroless nickel gold plating, electroplating nickel gold plating
Reinforcement fit tolerance ±0.2	±0.2
Shape tolerance: steel mold tolerance	±0.1mm
precision mold tolerance	±0.05mm
Impedance tolerance ±10%	±10%
Capacity
Single Layer	3500 square meters/month
Ordinary (impedance) double Layer	14000 square meters/month
3-4 layer soft board	1500 square meters/month
5-6 layer soft board	1300 square meters/month
7-8 layers soft board	1000 square meters/month
Sample delivery time
Single Layer	2-3days
Ordinary (impedance) double Layer	3-4days
3-4 layer soft board	7-9days
5-6 layer soft board	9-12days
7-8 layers soft board	12-15days
The first mass production delivery time
Single Layer	6days
Ordinary (impedance) double Layer	7days
3-4 layer soft board	12days
5-6 layer soft board	14days
7-8 layers soft board	15days

 

Product Description

 

Detailed Photos